Liu192837465jie

3716190576

[email protected]

3716190576

Wylie WL-69 BGA Reballing Stencil For Samsung CPU RAM Power WiFi IC Chip S9 S9+ Plus Snapdragon SDM845 Exynos 9810 PM845

{{ product.price_format }} Tasse escluse

{{ product.origin_price_format }}

disponibile:

SKU:{{ product.sku }}

modello: {{ product.model }}

{{ variable.name }}

{{ value.name }}

Dettagli prodotto

Wylie WL-69 BGA Reballing Stencil For Samsung CPU RAM Power WiFi IC Chip S9 S9+ Plus Snapdragon SDM845 Exynos 9810 PM845 BGA153