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Multifunctional Positioning Pressure-Reducing Protective Pad For BGA Repairing

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Multifunctional Positioning Pressure-Reducing Protective Pad For BGA RepairingBGA Chips Repairing Pressure-Reducing Protecting PadProduct Detail:Silicone material resistant to high temperatureSpecifically designed for repairing BGA chips of electronic productsEffectively avoid tin messing caused by the deformation of steel meshMultiple component slotsProduct Pack:Magic Pad*1