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3716190576

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3716190576

Wylie WL-74 BGA Reballing Stencil For HUAWEI Kirin 990 Hi990 Hi3690/Hi9500

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Dettagli prodotto

Wylie WL-74 BGA Reballing Stencil per HUAWEI Kirin 990 Hi990 Hi3690/Hi9500 CPU Chip IC Nova 6 5G/Honor V30 5G BGA200 153 di Latta Netto