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3716190576

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3716190576

Wylie WL-75 BGA Reballing Stencil for HUAWEI Honor 30/30s/X10 Nova 7/7Pro/7SE Kirin 985/820/Hi6290/Hi6290L CPU IC Chip T

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Dettagli prodotto

Wylie WL-75 BGA Reballing Stencil for HUAWEI Honor 30/30s/X10 Nova 7/7Pro/7SE Kirin 985/820/Hi6290/Hi6290L CPU IC Chip Tin Net