Liu192837465jie

3716190576

[email protected]

3716190576

Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Pl

{{ product.price_format }} Tasse escluse

{{ product.origin_price_format }}

disponibile:

SKU:{{ product.sku }}

modello: {{ product.model }}

{{ variable.name }}

{{ value.name }}

Dettagli prodotto

Wylie WL-80 BGA Reballing Stencil for Xiaomi Redmi K30Pro K30 Pro MI 10/10Pro Qualcomm 865 SM8250 CPU RAM Chip IC Tin Plant Net